Two Factors in the Advancement of Medical Electronics Technology

The advancement of medical electronics is driven by two major factors: technology and collaboration. Firstly, continuous advances in technology, including innovations in fields like microelectronics, nanotechnology, and biomedical engineering, have provided medical electronics engineers with increasingly efficient tools and equipment. Secondly, collaboration is key to the advancement of medical electronics technology. Medical electronics engineers need to work alongside other professionals, such as doctors, biologists, and manufacturers, to jointly develop and produce medical equipment that meets the needs of patients and improves medical standards.

Furthermore, the efforts of PCBA manufacturers are also crucial for the advancement of medical electronics technology. These manufacturers use advanced production technologies, such as SMT, COB, and others, to produce high-quality and high-precision medical electronic components, which provide reliable support for the development and production of medical equipment. They also work closely with medical electronics engineers and medical equipment manufacturers to jointly promote the development and progress of medical electronics technology.

Relying on the future of medical electronics

Medical electronic technology will be an essential support for future medical treatments. To facilitate the development of medical electronics technology, we should take the following measures:

Firstly, we should increase investment in the training of medical electronics engineers and cultivate more professionals in this field. These engineers should possess a deep understanding of both medical knowledge and engineering principles, enabling them to work with medical professionals to develop and design more sophisticated medical devices and technologies.

Secondly, investment in research and development for medical electronics manufacturers should be increased to encourage the development of more advanced medical electronic products. This will help to enhance the quality and performance of medical electronic products to better meet the requirements of the medical industry.

Thirdly, the development of intensive Medical PCB assembly technology should be promoted to improve the integration and performance of electronic products. This can be achieved through enhanced research and development of manufacturing processes and materials.

Lastly, we should promote the application and popularization of medical electronic technology. This can be accomplished by raising awareness and understanding of medical electronic technology among medical professionals and the general public through increased publicity and education. This will facilitate the widespread use and popularization of medical electronic technology.

さまざまな Web サイトで「PCBA」という言葉を目にするとき、より厳密な PCBA の概念を表しています。 ただし、PCBA は、リジッド ボード、フレキシブル ボード、さらには HID PCB の両方を指す場合があります。 電子製品の小型化のますます明白な特徴に直面して、FS Technology フレキシブル PCBA は、成形、曲げ、ねじれ、折り畳みが可能であり、電子プロジェクトの無限の可能性を実現するため、大きな人気を得ています。 最終的な目的として、リジッド、フレキシブル、またはリジッド フレックス PCBA のいずれであっても、それらは電子製品に同じ効果をもたらします。つまり、さまざまな電気部品と機械部品を接続します。 エレクトロニクス プロジェクトに使用するボードの種類を知るには、それらが作成される手順を理解する必要があります。

リジッド基板とフレキシブル基板の使い分け方

電子プロジェクトのコストに関しては、リジッド PCBA の価格は通常、フレキシブル回路基板の価格よりも低くなります。 FS Technologies が「通常」と呼ぶのは、PCBA のコストを構成するすべての要因が同じ場合です。 リジッド PCBA よりもフレックス ボードを使用する方が安価な場合があります。 ターンキー アセンブリの総所有コストを正確に把握するには、考慮すべき要素が多数あります: PCBA分析費用。 フレキシブル回路により、コネクタ、ワイヤ ハーネス、その他の回路基板などのコンポーネントが不要になります。 これらのコンポーネントを設計から削除することで、材料費、人件費、組み立て費、スクラップ コストが削減されます。

ラップトップとデスクトップ コンピューター、オーディオ キーボード、ソリッド ステート ドライブ、フラット パネル TV とモニター、子供のおもちゃ、その他の私たちの生活で使用されるデバイスは、通常、信頼性の要件を満たすために、柔軟なボードの代わりに FS テクノロジのリジッド ボードを使用します。 しかし、フレキシブル PCBA の価値が低いとは思わないでください。GPS ユニット、タブレット、スマートフォン、カメラ、ウェアラブル デバイスで広く使用されています。

より複雑な回路の場合、柔軟な PCBA を選択するのが最も賢明な選択です。 その 3 次元空間の制御は、他のどのタイプの PCB にも匹敵しません。 もちろん、これはローテクアプリケーションでの使用には影響しません。 ショッピングモールのカウンターのLED照明にはフレキシブル基板が使われており、設置が容易になるケースもあります。

リジッドPCBAとフレックス回路の類似点と相違点

リジッド PCBA プロジェクトを設計する場合、FS Technology は、最小穴サイズ、最小スペースとトレース幅、ボード エッジまでの最小距離、銅および全体の設計厚さなど、必要な特定の設計規則に従います。 リジッド回路とフレキシブル回路の設計要件には、実際には多くの共通点があります。 これらの一般的なプロセスは次のとおりです。

1. 穴あけ・貫通穴加工
2. メッキ
3. 光学イメージングと開発
4. 銅トレース、パッド、輪郭、およびプレーンのエッチング
5. ベーキングにより、PCB から水分を除去します。

フレキシブル回路オーバーレイ

中国で最もプロフェッショナルなターンキー PCBA アセンブリ会社である FS Technology は、回路オーバーレイまたはオーバーレイ プロセスを使用して、フレキシブル回路の外部回路をカプセル化および保護します。 フレックス回路のカバー フィルリジッド基板 のはんだマスクに似ていますが、1 つの本質があります。それは、カバー フィルムの方が柔軟性が高いということです。 fs-pcba.com によると、「カバー フィルムは通常、熱硬化性接着剤でコーティングされたポリイミド フィルムです。フィルムの厚さは .0005 インチから .005 インチの範囲で、.001 インチと .002 インチが最も一般的です。

ポリイミドと接着剤のオーバーレイは、圧力と熱を使用してラミネート加工されます。熱によって接着剤が流れやすくなり、トレースとパッドの間のギャップが埋められます。 これにより、層の間に空気が閉じ込められるのを防ぎます。 再び fs-pcba.com.ja から: 「接着剤の流れは、完全な表面接触とカプセル化を確実にするために必要です。接着剤は、下の画像に示されている開口部の周りでわずかににじむ傾向があります。このブリード押し出しは、しばしば「バインダー押し出し」と呼ばれます。 」であり、実際には理想的な現象です。

オーバーレイ積層プロセスが完了したら、ドリル、ルーティング、またはレーザー切断を使用して、コンポーネントおよび/または機能の開口部を作成します。 エッチングは使用できません。

リジッドおよびフレキシブル PCB の IPC 規格

IPC-2221A、プリント基板設計の一般規格

IPC-2223、フレキシブル プリント基板の分割設計に関する規格

IPC-4101、リジッドおよび多層プリント基板用基材の仕様

IPC-4202、フレキシブル プリント回路用フレキシブル ベース誘電体

IPC-4203、フレキシブル プリント回路のカバーおよびフレキシブル接着剤接合フィルムとして使用するための接着剤コーティング誘電体フィルム

IPC-4204、フレキシブル プリント回路の製造のためのフレキシブル メタル クラッド誘電体

IPC-6013、フレキシブル プリント回路の認定および性能仕様

リジッド基板とフレキシブル基板のまとめ

リジッド PCBA とフレキシブル PCBA は電子製品に同じ影響を与えますが、電子部品をリンクする役割しか果たしませんが、回路基板は依然として電子製造の重要な部分です。 ほとんどのエンジニアは同じエレクトロニクス プロジェクトにリジッド PCB とフレックス PCB を使用しますが、フレックス PCBA には追加の製造プロセス ステップがあるため、いくつかの特別な規則が必要です。 リジッド PCBA は低コストのように見えますが、回路基板の価格を評価する前に、1 枚の基板のコストではなく総コストを考慮する必要があります。

There are many types of contaminants on PCBA boards, which are mainly formed by the combination of physical bonds and chemical bonds.

Physical bond binding: The contaminants form physical tension with the surface of the PCBA, and are combined by the surface tension between the molecules. Since physical bonding is a physical effect, its physical bond energy is relatively low, generally between 0.8 × 103 to 2.1 × 104 J/mol. Turnkey PCBA companies use flux during assembly. If it is cleaned even if it is cleaned, the rosin, resin and residual glue attached to the PCBA will form a physical bond.

"Chemical bond" combination: refers to the chemical reaction between the pollutant and the surface of the PCBA, the atoms of the two are combined, and after the chemical reaction occurs, an ionic compound or a covalent compound will be formed. The strength of the "chemical bond" is relatively large between (4.2 ~ 8.4) × 105J/mol. The use of rosin acid by a turnkey PCBA assembly company has the potential to produce this effect. Rosin acid corrodes the surface of the PCBA board, and then the water in the air is used as a medium to cause the circuit board to conduct electricity. After the circuit board conducts electricity, a chemical reaction occurs to form ions.

Three types of PCBA pollutants

polar pollutants

Polar pollutants can be divided into inorganic pollutants, ionic residues, and ionic pollutants. After PCB assembly work, this contaminant on the PCBA will ionize under specific conditions to produce positively or negatively charged ionic compounds, commonly halides, acids and their salts. These different ionic compounds have different properties, and therefore different reactions occur in different solutions. When the assembly company does not follow the specifications, when the PCBA board is placed in a humid environment, due to the action of water, the electronic components generate electricity, and the ions of the polar pollutants will migrate toward the conductor with the opposite polarity. Soldered pins will be regarded as conductors. These conductive phenomena will lead to a decrease in insulation resistance and increase the leakage current between solder joints or wires. If not handled in time, a short circuit may occur or the circuit board may be directly burned.

The main types of ionic pollutants are as follows:

• FluxActivators
• Perspiration
• IonicSurfactants
• Ethanolamines
• OrganicAcids
• Plating Chemistries

non-polar contaminants

Non-polar pollutants mainly include organic pollutants and non-ionic pollutants. This non-polar contaminant on the PCBA cannot conduct electricity by itself, and FS Technology regards it as a resistor or an insulator on the circuit board. These non-polar pollutants will reduce the current of the running PCBA board. If the amount of such substances is too large, it will even lead to blocking the current, which is what we often call power outages. The specific reason needs to be analyzed by PCBA error to know. The most common ones are the resinous residue of rosin itself, the oxide protective film caused by redox reaction in wave soldering, and the grease or wax of SMT placement machine or DIP insertion machine. Of course, the most difficult thing to avoid is the grease on the workers during manual welding. These non-polar contaminants are super viscous and adsorbent. It will absorb dust in the air, and when combined with machine residues, it will produce an insulating film, thereby preventing electrical contact on the surface of PCB components such as connectors, switches, and relays. Maybe you don't think you need to pay too much attention to these problems, but FS Technology can tell you responsibly that these effects are very serious. At the beginning, it may only be a short-term poor contact, but as time goes on, this situation will intensify, and the resistance value of the circuit board will gradually increase, and even cause an open circuit in severe cases. Sometimes the rosin covering the solder joints also hinders the PCBA test, especially the non-polar contaminants will aggravate the degree of contamination with the combination of polar contaminants.

The main types of ionic pollutants are as follows:

• Rosin
• Oils
• Greases
• HandLotion
• Silicone
• Adhesive

particulate pollutants

Particulate pollutants refer to dust, smoke, fiberglass filaments and lint that are visible to the naked eye. It also includes solder balls or tin bead dross caused by improper operation during soldering. These large particles of contaminants also cause poor current flow, which can cause short circuits that can be harmful to electronic assemblies.

Particulate pollutants can be removed by mechanical methods such as high-pressure gas injection, manual peeling, and cleaning.

So far, the whole content of FS Technology on PCBA pollutants is over. If you need more professional PCBA knowledge, you can go to FS Technology's blog to view it.

The clock crystal and associated circuits should be placed in the center of the PCB and should have a good ground plane, not close to the I/O interface. Clock generation circuits are not allowed in the form of daughter cards or daughter boards, and must be fabricated on separate clock boards or load-bearing boards. Only the equipment related to the clock circuit is installed in the PCB clock circuit area of ​​FS TECH, avoid installing other circuits. Other signal lines should not be routed near or below the crystal: Clock circuits and ground planes are used under the crystal if other signals pass through the plane violating the image plane function. If the signal passes through the ground plane, there will be a small ground loop and affect the continuity of the ground plane.

Ground loops will have problems at high frequencies

Shielding measures can be used to shield the clock crystal and clock circuit;

If the clock case is metal metal, the PCB design must have copper under the crystal, and this part has a good electrical connection to the complete ground (through a porous ground). Advantages of laying ground under the FS Tech clock: The circuits inside the crystal oscillator generate RF currents. If the crystal is encased in a metal case, the DC power source discharges the transient current generated by the case through RF radiation through the ground plane, referenced to the DC voltage and the RF current circuit within the crystal.

In short, the metal casing is a single-ended antenna, and the nearest image layer, the ground plane layer, sometimes has two or more radiation coupling effects, as the RF current to the ground.

The bottom of the PCB crystal is also conducive to heat dissipation

The clock circuit and crystal ground will provide an image plane that reduces the common mode currents of the associated crystal and clock circuit, thereby reducing RF emissions. Ground can also absorb differential mode RF currents. This plane must be connected to the complete ground plane through multiple points and through multiple holes, which provides low impedance. To improve the effect of the ground plane, the clock circuit of FS Technology should be close to the ground plane. Since most of the surface mount crystals are packaged in plastic, the SMT packaged crystal has more RF energy radiation than the metal shell crystal, and the RF current in the crystal will radiate into the space and be coupled with other devices.

FS Technology-Only improve high-quality PCB assembly services for customers

Summary: In recent years, the management level of industrial equipment has improved significantly, so the number of industrial control boards in several industries has also increased. After the collapse of the regulatory industry, the cost of replacing equipment has also become a major headache for entrepreneurs. So do you know how to fix a circular screen? What are the steps to fix the round screen? Next, let's take a look at the knowledge of circuit board maintenance with FS Tech.

Look first, measure later

FS Technology recommends that you should check the navigation screen. If necessary, pay attention to the magnifying glass.

Mainly see:

1. Whether the cable is broken or short-circuited, especially the connecting wire printed on the round screen is broken or stuck.

2. Whether there are suitable components such as resistors, capacitors, inductors, diodes, triodes, etc. It was interrupted.

3. Is there any maintenance? Which parts were pressed? There are problems with welding, welding, improper installation, etc.

Inside out

When testing with a series switch, it is best to use a standard switch similar to the suggested design, if possible. Then use the VI Folding Bar function to make a negative comparison of the two plates. The test points start from the peripheral ports, and then from the outside to the inside, especially the capacitance comparison test. This covers losses when it is difficult to determine if the multimeter is leaking.

Easy before difficult

In order to improve the FS technology test results, some technical processing of the modified screen is required to interfere with the various interference factor tests before the online circuit board test. The specific conditions are:

1. Preparation before the test

Short circuit crossover oscillator circuit for high voltage power supply to open footwell. The charging and discharging of large capacitors can also cause interference.

2. Use the exclusion method to test the device

In online or similar device testing, for each device that passes the test (or abnormality), the test results are directly checked and recorded. If the test fails (or fails), it will be retried. If it still fails, FS Technology recommends that you check the test results first. This continues until the device is tested (or compared to the screen). Then deal with those devices that fail the test (or are impatient).

3. Use the ASA-VI curve scan test to compare and test the devices not covered by the test library

ASA-VI Smart Folding technology can be used for similar testing as any other device. While testing procedures may include equipment, there is a table to consider. Through comparative testing, the device has a high error rate and can detect errors. When testing your device over the web, this feature goes beyond the limitations of library testing devices and expands the selection of navigational agency failure detection devices.

static before moving

Currently, the functionality on the navigation screen may be limited to analyzing the navigation and characteristics of the device on the navigation screen. Therefore, if a defective board is manufactured, it must be placed on the first test equipment. For best results in this inspection job, judge whether the circle chart is appropriate. At this point, it's a good idea to check that the device's power is properly connected to the navigation screen, and that the connectors on the screen are connected. Make sure the influence of the circle context and the circle error are isolated, otherwise the correct action will be taken!